Mold Max™ 60

MoldMax60pint 29C7EA0B-A119-134C-B9E8-88BC4A030959
Tin Cure Silicone

High heat-resistant silicone rubber with Shore 60A hardness.

  • Shore 60 A hardness
  • Withstands up to 294°C (560°F)
  • Mix ratio 100A:3B by weight
  • Pot life 40 minutes, 
  • Cure time 24 hours
  • Low shrinkage
  • Low viscosity
€ 32.33

(€ 26.72 without 21% VAT)

In stock

Description

This silicone mold rubber is designed for high heat resistance, capable of withstanding temperatures up to 294°C (560°F). It has a low mixed viscosity and exhibits very low linear shrinkage once cured. The mix ratio is 100A:3B by weight, with a pot life of 40 minutes and a cure time of 24 hours. It is suitable for making foundry patterns, flat pattern reproductions, and casting low-melt metal alloys like tin and pewter.

Features

  • High heat resistance up to 294°C (560°F)
  • Low mixed viscosity
  • Very low linear shrinkage

Technical Properties

  • Mix Ratio By Weight: 100A:3B
  • Pot Life: 40 minutes
  • Cure Time: 24 hours
  • Shore Hardness: 60 A
  • Specific Gravity: 1.45 g/cc
  • Specific Volume: 0.69 cm³/g (19.1 cu. in./lb.)
  • Color: Red
  • Tensile Strength: 2.74 MPa (398 psi)
  • 100% Modulus: 2.28 MPa (331 psi)
  • Elongation at Break: 132%
  • Die B Tear Strength: 11.0 kN/m (63 pli)
  • Useful Temperature Range: -54°C to 294°C (-65°F to 560°F)
  • Dielectric Strength: >500 volts/mil
  • Dielectric Constant, 100Hz: 3.4
  • Dissipation Factor, 100Hz: 0.02
  • Volume Resistivity: 9.0E+14 ohm/cm
  • Thermal Conductivity: 0.347 W/m·K
  • Shrinkage: 0.0015 mm/mm
  • Mixed Viscosity: 20,000 mPa·s

Instructions

Preparation

Store and use materials at room temperature (23°C/73°F). Use products promptly due to limited shelf life. Wear safety glasses, long sleeves, and rubber gloves. Sulfur-based clays may inhibit curing, causing tackiness or incomplete curing. Test compatibility by applying a small amount of rubber to a non-critical area. If rubber remains gummy or uncured, inhibition has occurred.

Applying A Sealer / Release Agent

To prevent inhibition, apply a clear acrylic lacquer as a barrier coat and let it dry thoroughly. A release agent can ease demolding. Ease Release™ 200 is recommended for silicone molds. Lightly brush the release agent over all surfaces, then apply a light mist coating and let dry for 30 minutes.

Measuring & Mixing

Pre-mix Part A thoroughly. Weigh and mix parts A and B for 3 minutes, scraping the container sides and bottom. Vacuum degassing is recommended to remove air. Use a vacuum pump pulling at least 29 inches of mercury (1 Bar / 100 KPa). Allow room for material expansion. Vacuum until material rises, breaks, and falls, then continue for 1 minute.

Pouring / Curing / Post Curing

Pour mixture at the lowest point of the containment field, allowing it to flow uniformly. Ensure the liquid rubber levels at least 1.3 cm (1/2”) over the model's highest point. Cure for at least 24 hours at room temperature before demolding. Post cure for 4-5 hours at 65°C (150°F) to remove residual moisture and alcohol. Cool mold to room temperature before use. Do not cure below 18°C (65°F).

Decreasing Demold Time with Accel-T™ Silicone Cure Accelerator

Pre-mix Accel T™ with Part B before adding Part A. Note that working time is reduced, and library life of cured rubber decreases with more Accel-T™.

Using The Mold

New molds have natural release properties. Over time, mold lubricity may decrease, causing parts to stick. No release agent is needed for wax or gypsum. Use Ease Release™ 200 for polyurethane, polyester, and epoxy resins to extend mold life. For a dry matte finish, refer to Smooth-On’s FAQ for powder coating techniques. Improve low melt metal casting surface finish by dusting the mold cavity with talcum powder, brushing it on, and removing excess before casting. Use a dust mask when handling talc.

Mold Performance & Storage

Mold life depends on usage. Abrasive materials like concrete can erode detail, while non-abrasive materials like wax do not. Clean molds with soap solution and dry before storage. Assemble multi-part molds and store on a level surface in a cool, dry environment.

Specifications

Hundred Percent Modulus 331 psi
Color Red
Die B Tear Strength 63 pli
Mixed Viscocity 20,000 cps
Cure Time 24 hours
Useful Temperature Min -65 °F
Pot Life 40 minutes
Specific Volume 19.1 cu. in./lb.
Specific Gravity 1.45 g/cc
Mix Ratio By Weight 100A:3B
Shrinkage 0.0015 in. / in.
Dielectric Strength >500 volts/mil
Tensile Strength 398 psi
Elongation At Break 132 %
Dielectric Constant 100hz 3.400000
Shore A Hardness 60
Volume Resistivity 9.000000E+14 ohm/cm
Dissipation Factor 100hz 0.020000
Thermal Conductivity 0.347 W/M*K
Available in Tin Cure Silicone
Product Cure Time Shore A Hardness Specific Gravity Specific Volume Tensile Strength Shrinkage Elongation At Break Hundred Percent Modulus Die B Tear Strength Useful Temperature Min Dielectric Strength Dielectric Constant 100hz Dissipation Factor 100hz Volume Resistivity Volume Resistance Mixed Viscocity Mix Ratio By Weight Pot Life Hundred Percent Modulus Color Die B Tear Strength Mixed Viscocity Useful Temperature Min Cure Time Pot Life Specific Volume Specific Gravity Mix Ratio By Weight Shrinkage Dielectric Strength Tensile Strength Elongation At Break Dielectric Constant 100hz Shore A Hardness Volume Resistivity Dissipation Factor 100hz Volume Resistance Thermal Conductivity Thermal Conductivity
Mold Max™ 25 24 h. 25 1.18 g/cc 23.5 cu. in./lb. 577 psi 0.001 in. / in. 375 % 80 psi 130 pli -65 °F 330 volts/mil 3.29 0.005 5.83E+13 ohm/cm 8.29E+11 ohm 25,000 cps 100A:5B 60 min. 80 psi Purple 130 pli 25,000 cps -65 °F 24 h. 60 min. 23.5 cu. in./lb. 1.18 g/cc 100A:5B 0.001 in. / in. 330 volts/mil 577 psi 375 % 3.290000 25 5.83E+13 ohm/cm 0.005000 8.29E+11 ohm - -
Mold Max™ 60 24 h. 60 1.45 g/cc 19.1 cu. in./lb. 398 psi 0.0015 in. / in. 132 % 331 psi 63 pli -65 °F >500 volts/mil 3.4 0.02 9.000000E+14 ohm/cm - 20,000 cps 100A:3B 40 min. 331 psi Red 63 pli 20,000 cps -65 °F 24 h. 40 min. 19.1 cu. in./lb. 1.45 g/cc 100A:3B 0.0015 in. / in. >500 volts/mil 398 psi 132 % 3.400000 60 9.000000E+14 ohm/cm 0.020000 - 0.347 W/M*K 0.347 W/M*K
Mold Max™ 20 24 h. 20 1.18 g/cc 23.5 cu. in./lb. 555 psi 0.001 in. / in. 512 % 49 psi 110 pli -65 °F 330 volts/mil 3.29 0.005 5.83E+13 ohm/cm 8.29E+11 ohm 25,000 cps 100A:10B 45 min. 49 psi Light Pink 110 pli 25,000 cps -65 °F 24 h. 45 min. 23.5 cu. in./lb. 1.18 g/cc 100A:10B 0.001 in. / in. 330 volts/mil 555 psi 512 % 3.290000 20 5.83E+13 ohm/cm 0.005000 8.29E+11 ohm - -
Mold Max™ 30 24 h. 30 1.18 g/cc 23.5 cu. in./lb. 577 psi 0.002 in. / in. 300 % 110 psi 125 pli -65 °F 330 volts/mil 3.29 0.005 5.83E+13 ohm/cm 8.29E+11 ohm 25,000 cps 100A:10B 45 min. 110 psi Pink 125 pli 25,000 cps -65 °F 24 h. 45 min. 23.5 cu. in./lb. 1.18 g/cc 100A:10B 0.002 in. / in. 330 volts/mil 577 psi 300 % 3.290000 30 5.83E+13 ohm/cm 0.005000 8.29E+11 ohm - -
Mold Max™ 10 24 h. 10 1.15 g/cc 24.1 cu. in./lb. 473 psi 0.001 in. / in. 529 % 35 psi 100 pli -65 °F 330 volts/mil 3.29 0.005 5.83E+13 ohm/cm 8.29E+11 ohm 15,000 cps 100A:10B 45 min. 35 psi Light Pink 100 pli 15,000 cps -65 °F 24 h. 45 min. 24.1 cu. in./lb. 1.15 g/cc 100A:10B 0.001 in. / in. 330 volts/mil 473 psi 529 % 3.290000 10 5.83E+13 ohm/cm 0.005000 8.29E+11 ohm - -
Mold Max™ 40 24 h. 40 1.14 g/cc 24.3 cu. in./lb. 550 psi 0.004 in. / in. 250 % 190 psi 120 pli -65 °F 330 volts/mil 3.29 0.005 5.83E+13 ohm/cm 8.29E+11 ohm 45,000 cps 100A:10B 45 min. 190 psi Mint Green 120 pli 45,000 cps -65 °F 24 h. 45 min. 24.3 cu. in./lb. 1.14 g/cc 100A:10B 0.004 in. / in. 330 volts/mil 550 psi 250 % 3.290000 40 5.83E+13 ohm/cm 0.005000 8.29E+11 ohm - -

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